| 工艺条件/ Processing Conditions | |
| 传统压机/ Traditional laminator: | 快压机High-speed liminator: |
| 温度Temperature: 160~ 155℃ | 温度Temperature: 165~ 175℃ |
| 压力/Pressure: 2 ~ 3mpa=(40 ~ 60kg/ cm) | 压力/Pressure: 1.5 ~ 2.5mpa= (30 ~ 40kg/ cm) |
| 时间/Time: 40 ~ 60min | 时间/Time: 5~ 10min |
| 烘烤/Baking:不需要/unnecessary | 烘烤/Baking: 1 60"C *60min |
HTK215
| 测试项目/Testing Items | 单位/ Unit | HTK215 | 测试方法/ Testing Method | ||
| 产品构成/ Composition of product | μm | ||||
| 胶粘剂/ Adhesive | 15 | ||||
| Pl膜/ Pl film | 12.5 | ||||
| 总厚度/ Total thickness | 27.5±3 | ||||
| 剥离强度 Peeling intensity | 原始状态/ Original state | N/mm | ≥1.0 | JIS C 6471 8.1.5 | |
| 260C热冲击处理后/Ater being treated through 260C heat impulsionl | ≥1.0 | ||||
| 200C干热处理后/ After being treated by dry heat of 200C | ≥1.0 | ||||
| 树脂流动性/ Resin fluidity | μm | ≤100 | IPC-TM-650 2.3.17 | ||
| 吸水性/ Water absorption | % | ≤1.45 | IPC-TM-650 2.6.2 | ||
| 表面电阻/ Surface resistance | Ω | 1.0 x 1010 | JIS C 6471 7.1 | ||
| 尺寸稳定性/ Dimensional stability | M.D. | % | -0.4~0 | JIS C 64719.6 | |
| T.D. | -0.2~0 | ||||
| 耐浸焊性/ Solder resistance | ℃ | 300℃/60sec | JIS C 6471 9.3 | ||
| Tg温度/Tg temperature | ℃ | 90 | (TMA) | ||
| 卤素成份/Halogen composition | PPM | 672 | C1 +Br< 900ppm | ||
| 耐燃性/ Burning resistance | Grade | Pass | UL 94V0/File No E321938 | ||
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